Packaging International News - July 2012

Bemis and Thin Film Work On Intelligent Packaging

Posted by Paul Fiddian - Packaging International's Lead Reporter on 12/07/2012 - 10:15:00

Intelligent Packaging Sensor

Flexible packaging firm Bemis has joined forces with printed electronics manufacturer Thin Film to create a new generation of intelligent food and drugs packaging.

Their collaboration is set to result in packaging that can stream data via wifi, advising on issues like shipping dates and then pointing out when foods start to lose their freshness and drugs start to lose potency.

Thin Film Electronics is already involved in time temperature sensor development. Through working with Bemis, it will take this research one stage further to produce a fully-customisable sensor platform, able to acquire and store data relating to key food properties and environmental conditions.

Intelligent Packaging Sensor

According to information now released both by Bemis and Thin Film electronics, a 2014 release is now expected for this intelligent packaging sensor.

Packaging manufactured by Bemis is presently used for a variety of products including foods, drugs and personal care items. Established in 1858, it currently has around 20,000 employees located around the world.

"Intelligent packaging is an emerging technology with many potential intersections with Bemis' flexible packaging and pressure sensitive materials business segments", Bemis' CEO and President Henry Theisen explained in a company press release.

"Our agreement with Thin Film represents an investment in a technology that could eventually make printed electronics a component of every package we manufacture."

Bemis and Thin Film

"These are exciting times for the printed electronics market, where innovative solutions that simply could not be manufactured before are soon to be delivered", Thin Film Electronics' CEO Davor Sutija added.

"Our partnership with Bemis will lead to new categories and types of packaging that will bring intelligence to everyday lives of millions of people worldwide. We are excited to work with the company because of their distinguished history of innovation and their vision for printed electronics."

Packaging International will cover further developments in Bemis and Thin Film's collaboration in future News Items.

Image copyright LINPAC Packaging

Image used for representative purposes only

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